| 摘要 |
Provided is a curable silicone composition that exhibits excellent adhesion with respect to an optical semiconductor element, a lead frame, a substrate, a bonding wire, and the like in an optical semiconductor device and that comprises at least: an organopolysiloxane (A) that comprises at least two silicon-bonded alkenyl groups per molecule; an organohydrogenpolysiloxane (B) that comprises at least two silicon-bonded hydrogen atoms per molecule; a triazole compound (C); a metal-based condensation reaction catalyst (D); and a hydroxysilylation reaction catalyst (E). Also provided is an optical semiconductor device that exhibits excellent reliability after a moisture absorption reflow test and that comprises an optical semiconductor element that is sealed or coated with a cured product of the composition. |
