发明名称 METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a small size case mold type capacitor with a superior leakage current characteristic and a humidity resistance property.SOLUTION: The metalized film of the metallized film capacitor includes: a dielectric film 2A; a first metal vapor deposition electrode 4A formed over the upper face of the dielectric film 2A; and a second metal vapor deposition electrode 9A which has the upper face faced to the bottom face of the first metal vapor deposition electrode 4A being interposed by the dielectric film 2A. At least one of the metal vapor deposition electrodes in the first metal vapor deposition electrode 4A and the second metal vapor deposition electrode 9A contains aluminum and magnesium. In the at least one metal vapor deposition electrode, the magnesium is unevenly distributed in a vertical thickness direction with respect to the upper face of the metal vapor deposition electrode.
申请公布号 JP2015073112(A) 申请公布日期 2015.04.16
申请号 JP20140234158 申请日期 2014.11.19
申请人 PANASONIC IP MANAGEMENT CORP 发明人 TAKEOKA HIROKI;KUBOTA HIROSHI;OCHI YUKIKAZU;FUJII HIROSHI;SHIMASAKI YUKIHIRO
分类号 H01G4/015;H01G4/18 主分类号 H01G4/015
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