发明名称 HEAT DISSIPATING MEMBER AND HEAT DISSIPATING STRUCTURE OF EXOTHERMIC BODY
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat dissipating member that eliminates drawbacks of conventional metal heat-dissipating members with heavy weight and poor moldability.SOLUTION: A heat dissipating member 1 comprises a high thermal conductive resin 3 having a substrate 3A and a fin 3B (an erection section) protruding from the substrate 3A, laminated and integrated to the vicinity area of one edge of a base section including a metal plate 2. The high thermal conductive resin 3 is made of a high thermal conductive resin composition having thermal conductivity of 0.5 W/m.K or more. A heat receiving section 2X of the metal plate 2 is abutted on an exothermic body such as an electric cell to dissipate heat of the exothermic body from the fin 3B through the metal plate 2. In the heat dissipating member of the present invention, at least the erection section for dissipating heat, namely a section that is generally shaped finely and complicatedly to increase efficiency of heat dissipation, is made of the high thermal conductive resin composition so that the erection section can be easily shaped as desired by molding such as injection molding. Also, at least part of the heat dissipating member made of resin allows for weight reduction of the heat dissipating member.</p>
申请公布号 JP2015073100(A) 申请公布日期 2015.04.16
申请号 JP20140213494 申请日期 2014.10.20
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 OCHIAI KAZUAKI;OSHIMA TERU
分类号 H05K7/20;H01M10/60;H01M10/613;H01M10/617;H01M10/625;H01M10/643;H01M10/647;H01M10/651;H01M10/652;H01M10/653;H01M10/6551;H01M10/6555;H01M10/6563 主分类号 H05K7/20
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