发明名称 SEMICONDUCTOR DEVICE FOR BATTERY POWER VOLTAGE CONTROL
摘要 A voltage generated in any of a plurality of semiconductor chips is supplied to another chip as a power supply voltage to realize a stable operation of a semiconductor device in which the semiconductor chips are stacked in the same package. For example, two chips are stacked with each other, first to third pads are disposed along corresponding sides of the respective chips, which are arranged close and in parallel to each other, and these pads are commonly connected to each other with first to third metal wires, respectively. In another example, fourth and fifth pads are disposed along a side different from a side along which the first to third pads are disposed, and further connected to each other with a fourth metal wire directly between the chips.
申请公布号 US2015102501(A1) 申请公布日期 2015.04.16
申请号 US201414518003 申请日期 2014.10.20
申请人 Renesas Electronics Corporation 发明人 Komatsu Mikihiko;Hidaka Takao;Kimura Junko
分类号 H01L23/48;H01L23/00 主分类号 H01L23/48
代理机构 代理人
主权项 1. A semiconductor device, comprising: a first semiconductor chip having a first main surface over which a plurality of electrode pads are formed; a second semiconductor chip having a second main surface over which a plurality of electrode pads are formed; a plurality of external terminals; and a sealing body sealing the first and second semiconductor chips, wherein the first semiconductor chip includes: a first electrode pad supplied with an external power supply voltage from a first external terminal; a regulator circuit which is electrically connected with the first electrode pad and generates an internal power supply voltage by stepping down the external power supply voltage according to a reference voltage and an input voltage to be compared with the reference voltage; and a second electrode pad which is electrically connected to the regulator circuit and from which the internal power supply voltage is output, wherein the second semiconductor chip includes: a third electrode pad to which the internal power supply voltage is input from the second electrode pad of the first semiconductor chip, wherein the second and third electrode pads are electrically connected to a second external terminal via a first wire and a second wire, respectively, wherein an end portion of the first wire is electrically connected to the second electrode pad, wherein an end portion of the second wire is electrically connected to the third electrode pad, and wherein another end portion of each of the first and second wires is electrically connected to the second external terminal.
地址 Kanagawa JP