| 摘要 |
A nozzle section (43) for sucking a component is rotatably provided to a nozzle holder section (41) of a suction nozzle (40) held by means of a mounting head of a component mounting apparatus, and it is configured such that the attitude of the nozzle section (43) can be changed 90° to be in the downward direction and in the horizontal direction by rotating the nozzle section (43). At the time of sucking the component, the component is sucked to the nozzle section (43) from above in a state wherein the attitude of the nozzle section (43) of the suction nozzle (40) is in the downward direction, and at the time of mounting the component, the attitude of the nozzle section (43) is changed 90° to be in the horizontal direction by rotating the nozzle section (43), and in a state wherein the attitude of the component sucked to the nozzle section (43) is in the horizontal direction, the component is mounted to a subject, such as a circuit board. |
