| 摘要 |
PROBLEM TO BE SOLVED: To achieve downsizing and thinning of a semiconductor device.SOLUTION: In a flip-chip connection structure semiconductor package 6 which includes: a semiconductor chip 1 including a principal surface 1a where a plurality of electrode pads 1c are formed and a rear face 1b on the opposite side; four lead terminals 2 each including a top face 2a where the semiconductor chip 1 is mounted and an under surface 2b on the opposite side; and an encapsulation body 4 including a principal surface 4a and a rear face 4b on the opposite side, by making a distance between first under surfaces 2c which are exposed on the rear face 4b of the encapsulation body 4, of the four lead terminals 2 longer than a distance between the top faces 2a, the occurrence of a solder bridge on a mounting substrate at the time of solder mounting can be inhibited, and reliability of the semiconductor package 6 can be improved while achieving downsizing and thinning of the semiconductor package 6. |
