| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cap for hermetic seal capable of suppressing reduction of the amount of solder in a region where an electronic component housing member is joined, by suppressing spread (wet spread) of a portion of molten solder to the outer side face of the cap for hermetic seal.SOLUTION: A cap 1 for hermetic seal includes a base material 2, an Ni plating layer 3 formed on the surface 2a of the base material 2, and an Au plating layer 4 formed on the surface 3a of the Ni plating layer 3. The surface 2a of the base material 2 is sectioned into a solder region S3 where an electronic component housing member 20 is joined via the solder, a plating region S4 that is on the inside of the solder region S3 and not contiguous thereto, an oxidation region S2 that is on the inside of the solder region S3 and contiguous thereto, and an oxidation region S1 that is on the outside of the solder region S3 and contiguous thereto. In the oxidation regions S1 and S2, the Ni plating layer 3 is exposed and oxidized.</p> |
