| 摘要 |
PROBLEM TO BE SOLVED: To provide a power conversion device which reduces mechanical stress to a power semiconductor module terminal, without need of an installation space in front of the power semiconductor module terminal.SOLUTION: The power conversion device includes a power semiconductor module mounted on both sides of a heat pipe type cooling block, and a smoothing capacitor connected to the power conversion device from a cathode and an anode of the power semiconductor module through a bus bar. The power conversion device further includes a snubber module having an embedded snubber for suppressing a leap voltage in switching the power semiconductor module, and having terminals protruding from both side faces. The snubber module is disposed below the block, and the terminals are respectively connected to the bus bar. |
