| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for producing a photomask for wafer processing capable of easily and inexpensively producing a photomask.SOLUTION: There is provided a method for producing a photomask for wafer processing, which comprises: a step of preparing a translucent plate which has a size equal to or larger than a size of a wafer to be processed and transmits light and a light shielding plate which has a size equal to or larger than a size of a wafer to be processed and shields light; a step of forming a groove not reaching the rear surface on the surface of the light shielding plate in an area through which light is to be transmitted; a step of integrally sticking the light shielding plate to the surface of the light shielding plate on which a groove is formed via a bonding agent which transmits light; and after implementation of the integration step, a step of grinding the rear surface of the light shielding plate by holding the light shielding plate side on a chuck table to expose the groove to the rear surface.</p> |
