SINTERED BACKSIDE SHIM IN A PRESS PACK CASSETTE

摘要

Within a cassette of a press pack module, a conductive shim is bonded to the backside of a device die by a layer of sintered metal. The die, sintered metal, and shim together form a sintered assembly. The cassette is compressed between a metal top plate member and a metal bottom plate member such that the backside of the assembly is pressed against the top plate member, and such that the frontside of the assembly is pressed against another shim. A central portion of the frontside surface of the die is contacted on the bottom by the other shim, but there is no shim contacting a peripheral portion of the frontside surface. Despite there being no shim in contact with the peripheral portion of the frontside surface, the peripheral portion is in good thermal contact with the top plate member through the sintered metal and the bonded conductive shim.

主权项

1. A power semiconductor device module, comprising:
a bottom plate member having a plurality of pedestals; a frame disposed around one of the pedestals; one or more first metal shims, wherein said one or more first metal shims are stacked onto said one pedestal; a sintered assembly, wherein the sintered assembly comprises a semiconductor device die that is bonded by a layer of electrically conductive sintered metal to a second metal shim; and a top plate member, wherein said one or more first metal shims and the sintered assembly are compressed between the top plate member and the pedestal of the bottom plate member.