| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
There is provided a method for manufacturing a printed circuit board including: preparing a substrate having a conductive layer formed on at least a portion thereof; forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate; forming a plating seed layer on the insulating layer and the exposed conductive layer; forming an electroplating layer on the plating seed layer by overplating the plating seed layer; and etching the overplated portion in a lump to form a circuit layer in the opening. |
| 申请公布号 |
US2015101857(A1) |
申请公布日期 |
2015.04.16 |
| 申请号 |
US201414500953 |
申请日期 |
2014.09.29 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
KIM Da Hee;PARK Jung Hyun;CHO Yong Yoon;JEONG Sung Won;HAN Gi Ho;KIM Ki Hwan |
| 分类号 |
H05K1/02;H05K3/46;H05K3/02;H05K3/00;H05K1/11;H05K3/06 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a printed circuit board, the method comprising:
preparing a substrate having a conductive layer formed on at least a portion thereof; forming an insulating layer formed with an opening through which a portion of the conductive layer is exposed on the substrate; forming a plating seed layer on the insulating layer and the exposed conductive layer; forming an electroplating layer on the plating seed layer by overplating the plating seed layer; and etching the overplated portion in a lump to form a circuit layer in the opening. |
| 地址 |
Suwon-Si KR |
