PRINTED CIRCUIT BOARDS HAVING METAL LAYERS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

摘要

Printed circuit boards are provided. The printed circuit board includes an insulation layer, an interconnection portion and a metal layer. The insulation layer has a flat plate shape and includes a top surface and a bottom surface. The interconnection portion is disposed on at least one of the top and bottom surfaces of the insulation layer. The interconnection portion includes a plurality of interconnection patterns. The metal layer covers the plurality of interconnection patterns of the interconnection portion. Related semiconductor packages are also provided.

主权项

1. A printed circuit board comprising:
an insulation layer having a flat plate shape and including a top surface and a bottom surface; an interconnection portion formed on at least one of the top and bottom surfaces of the insulation layer, the interconnection portion including a plurality of interconnection patterns; and a metal layer covering the plurality of interconnection patterns of the interconnection portion.