| 发明名称 |
Integrated Fan-Out Structure with Openings in Buffer Layer |
| 摘要 |
A package includes a molding compound, a through-via penetrating through the molding compound, a device die molded in the molding compound, and a buffer layer on and contacting the molding compound. An opening is through the buffer layer to the through-via. The buffer layer has ripples in a plane parallel to an interface between the molding compound and the buffer layer and around a circumference of the opening. Other embodiments contemplate an additional package bonded to the package, and methods for forming the package. |
| 申请公布号 |
US2015102502(A1) |
申请公布日期 |
2015.04.16 |
| 申请号 |
US201414577450 |
申请日期 |
2014.12.19 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chiu Wu Sen;Cheng Li-Hui;Tsai Po-Hao;Lin Jing-Cheng |
| 分类号 |
H01L23/48;H01L25/10;H01L23/31;H01L21/56;H01L21/768 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure comprising:
a first package comprising:
a molding compound;a through-via penetrating through the molding compound;a device die molded in the molding compound; anda buffer layer on and contacting the molding compound, an opening being through the buffer layer to the through-via, the buffer layer having ripples in a plane parallel to an interface between the molding compound and the buffer layer and around a circumference of the opening. |
| 地址 |
Hsin-Chu TW |
