Vorrichtung zum Separieren von Wafern

摘要

The invention relates to a device for separating wafers from a wafer stack which is located on a support device in a liquid container, said support device being equipped with an advancing device for the wafer stack. The aim of the invention is to provide a device which is particularly easy to implement and with which the separation process is carried out in a completely contactless manner. This is achieved in that the support device (3) is angled diagonally to the base (4.1) of the liquid container (4), and the wafer stack (1) which can be found on the support device (3) on a bearing surface (3.1) is supported by an advancing device (5) in order to continuously or incrementally advance the wafer stack (1). The bearing surface (3.1) terminates at a sliding edge (6) at the upper end of said bearing surface, and a slideway (7) for the wafer (8) adjoins the sliding edge, said slideway being oriented downwards and running to the base (4.2) of the liquid container (4). Nozzles (10) which generate directed liquid flows are provided, said nozzles generating liquid flows which are oriented laterally against the edges of the uppermost wafer (8) in the wafer stack (1) and at least into the intermediate space to the following wafer.