CHIP HEAT DISSIPATION STRUCTURE AND LIQUID CRYSTAL DISPLAY HAVING THEREOF

摘要

A chip heat dissipation structure and a liquid crystal display having thereof are provided. The chip heat dissipation structure includes a metal heat dissipation member contacted with a chip. The metal heat dissipation member is connected to a metal protection cover of a printed circuit board. The metal heat dissipation member is perpendicular to the metal protection cover. The present invention also relates to a liquid crystal display. The chip heat dissipation structure and a liquid crystal display having thereof of the present invention have a good heat dissipation effect.

主权项

1. A chip heat dissipation structure, which is disposed in a liquid crystal display, wherein the chip heat dissipation structure comprising:
a metal heat dissipation member, being closely adjacent to a chip in the liquid crystal display and contacting with the chip, the metal heat dissipation member being connected to a metal protection cover of a printed circuit board in the liquid crystal display, and the metal heat dissipation member being perpendicular to the metal protection cover; the metal heat dissipation member being formed by bending the metal protection cover of the printed circuit board; the metal heat dissipation member including at least one protrusion, the protrusion protruding toward the chip, and the protrusion forming a face contact with the chip.