发明名称 TRANSPARENT CONDUCTIVE SUBSTRATE PRODUCTION METHOD, TRANSPARENT CONDUCTIVE SUBSTRATE, AND ELECTROSTATIC CAPACITANCE TOUCH PANEL
摘要 Provided are a transparent conductive substrate production method for an electrostatic capacitance touch panel having a high pattern recognition property, by simple steps without using a vacuum process and a wet etching method, as well as a transparent conductive substrate and an electrostatic capacitance touch panel. An electrode drawing lead wiring pattern is formed on at least one main face of a transparent film using a conductive paste. An electrode pattern forming unit prints an electrode pattern with a transparent conductive pattern forming ink containing metal nanowires or metal nanoparticles so that the electrode pattern is connected to the electrode drawing lead wiring pattern, and dries the printed electrode pattern. The dried electrode pattern is subjected to pulsed light irradiation by a photoirradiation unit 18, to sinter the metal nanowires or the metal nanoparticles contained in the transparent conductive pattern forming ink.
申请公布号 US2015103269(A1) 申请公布日期 2015.04.16
申请号 US201314396994 申请日期 2013.04.26
申请人 OSAKA UNIVERSITY ;SHOWA DENKO K.K. 发明人 Suganuma Katsuaki;Uchida Hiroshi;Shinozaki Kenji
分类号 G06F3/044;H05K3/12;H05K3/28;H05K1/09 主分类号 G06F3/044
代理机构 代理人
主权项 1. A transparent conductive substrate production method comprising, a step for forming an electrode drawing lead wiring pattern by printing with a conductive paste, on at least one main face of a transparent substrate, an electrode printing step for printing an electrode pattern to be connected to the electrode drawing lead wiring pattern, with a transparent conductive pattern forming ink containing metal nanowires or metal nanoparticles, and shape-holding material, an electrode drying step for drying the electrode pattern, and an electrode sintering step for subjecting the dried electrode pattern to pulsed light irradiation to sinter the metal nanowires or the metal nanoparticles.
地址 Suita-shi, Osaka JP