| 摘要 |
A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit board (PCB) defines a first area, a second area, and a third area connected in the described order. The rigid-flexible PCB includes a first flexible PCB, a second flexible PCB adhered with the first flexible PCB through a bonding sheet in the third area, and, a first conductive layer and a second conductive layer formed on opposite side of the rigid-flexible PCB in the first area and the third area. The first flexible PCB is apart from the second flexible PCB in the first area and the second area. |
| 主权项 |
1. A method for manufacturing a rigid-flexible printed circuit board (PCB), comprising:
providing a first flexible PCB and a second flexible PCB, the first flexible PCB having a first surface and a second surface opposite to, and substantially parallel to, the first surface, the second flexible PCB having a first surface and a second surface opposite to, and substantially parallel to, the first surface, the first flexible PCB defining a first portion, a second portion, and a third portion connected in described order, the second flexible PCB defining a fourth portion, a fifth portion, and a sixth portion connected in described order; providing a bonding sheet having a first surface and a second surface opposite to, and substantially parallel to, the first surface; adhering the first surface of the third portion to the first surface of the bonding sheet, and adhering the first surface of the sixth portion to the second surface of the bonding sheet, the fourth, fifth, and sixth portion of the second flexible PCB being respectively aligned with the first, second, and third portion of the first flexible PCB; and forming a first prepreg sheet and a first conductive layer on the second surface of the first and third portion, and forming a second prepreg sheet and a second conductive layer on the second surface of the fourth and sixth portion, the first prepreg sheet being adhered with the second surface of the first and third portion, the second prepreg sheet being adhered with the second surface of the fourth and sixth portion, the first conductive layers being adhered with a surface of the first prepreg sheet away from the first flexible PCB, the second conductive layers being adhered with a surface of the second prepreg sheet away from the second flexible PCB, thereby, obtaining a rigid-flexible PCB; wherein the first and second portion of the first flexible PCB are separated from the fourth and fifth portion of the second flexible PCB. |
