| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device 1 which enables easy manufacturing and achieves high reliability.SOLUTION: A semiconductor device 1 includes: a semiconductor chip 10 having a substrate part 11 in which a semiconductor circuit 12 is formed and a multilayer wiring circuit 13 including a conductor layer 20 connected with the semiconductor circuit 12 and an insulation layer 30 made of a low dielectric constant material having a dielectric constant lower than that of silicon, the semiconductor chip 10 where the insulation layer 30 is exposed on a side surface; and a protection layer 40 which covers at least a region of an outer peripheral surface of the semiconductor chip 10 where the insulation layer 30 is exposed, the protection layer 40 made of a material which is more excellent than the low dielectric constant material in moisture resistance.</p> |
