发明名称 |
FILM FORMATION METHOD FOR GOLD-IRON-BASED AMORPHOUS ALLOY PLATING THIN FILM, ELECTROPLATING LIQUID, AND GOLD-IRON-BASED AMORPHOUS ALLOY PLATING THIN FILM |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a gold-iron-based amorphous alloy plating thin film which is composed of a homogeneous amorphous alloy free of fine crystals, has high hardness unattainable with conventional hard gold plating thin films and amorphous gold alloy plating thin films and is thus useful as a contact material for e.g. complex and fine micro-connectors and micro-relays.SOLUTION: An amorphous alloy plating thin film containing gold and iron is formed on a to-be-plated object by electroplating with a current density of 20 mA cmby using an electroplating liquid containing a water-soluble gold salt, a water-soluble iron salt, citric acid and glycine and having a pH of 4-11.</p> |
申请公布号 |
JP2015071820(A) |
申请公布日期 |
2015.04.16 |
申请号 |
JP20140087884 |
申请日期 |
2014.04.22 |
申请人 |
WASEDA UNIV |
发明人 |
AISAKA TETSUYA;YOKOSHIMA TOKIHIKO;SUGIYAMA ATSUSHI;HACHISU TAKUMA |
分类号 |
C25D3/56;C25D5/50;C25D7/00 |
主分类号 |
C25D3/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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