发明名称 FILM FORMATION METHOD FOR GOLD-IRON-BASED AMORPHOUS ALLOY PLATING THIN FILM, ELECTROPLATING LIQUID, AND GOLD-IRON-BASED AMORPHOUS ALLOY PLATING THIN FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a gold-iron-based amorphous alloy plating thin film which is composed of a homogeneous amorphous alloy free of fine crystals, has high hardness unattainable with conventional hard gold plating thin films and amorphous gold alloy plating thin films and is thus useful as a contact material for e.g. complex and fine micro-connectors and micro-relays.SOLUTION: An amorphous alloy plating thin film containing gold and iron is formed on a to-be-plated object by electroplating with a current density of 20 mA cmby using an electroplating liquid containing a water-soluble gold salt, a water-soluble iron salt, citric acid and glycine and having a pH of 4-11.</p>
申请公布号 JP2015071820(A) 申请公布日期 2015.04.16
申请号 JP20140087884 申请日期 2014.04.22
申请人 WASEDA UNIV 发明人 AISAKA TETSUYA;YOKOSHIMA TOKIHIKO;SUGIYAMA ATSUSHI;HACHISU TAKUMA
分类号 C25D3/56;C25D5/50;C25D7/00 主分类号 C25D3/56
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