| 发明名称 |
RESIN COMPOSITION, RESIN MOLDING, METHOD OF PRODUCING RESIN MOLDING AND LASER DIRECT STRUCTURING ADDITIVE |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having excellent plating properties.SOLUTION: A resin composition comprises thermoplastic resin, and a laser direct structuring additive comprising at least two metals and also comprising a conductive oxide with a resistivity of 5×10&OHgr; cm or less. |
| 申请公布号 |
JP2015071739(A) |
申请公布日期 |
2015.04.16 |
| 申请号 |
JP20140115821 |
申请日期 |
2014.06.04 |
| 申请人 |
MITSUBISHI ENGINEERING PLASTICS CORP |
发明人 |
KIKUCHI TATSUYA;YAMADA RYUSUKE;YAMANAKA YASUSHI |
| 分类号 |
C08L101/00;C08K3/22;C08K3/34;C08K3/40;C08L25/04;C08L67/00;C08L69/00;C08L77/00;C23C18/31;C23C18/38;H01B5/14;H01B13/00 |
主分类号 |
C08L101/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
