| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to the present invention may include: a plurality of circuit layers; and a plurality of insulating layers interposed between the plurality of circuit layers, wherein two adjacent insulating layers of the plurality of insulating layers have different thicknesses. |
| 申请公布号 |
US2015101846(A1) |
申请公布日期 |
2015.04.16 |
| 申请号 |
US201414160209 |
申请日期 |
2014.01.21 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
Kang Ho Shik;Park Jong Tae |
| 分类号 |
H05K1/02;H05K3/00;H05K3/46 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
a plurality of circuit layers; and a plurality of insulating layers interposed between the plurality of circuit layers, wherein two adjacent insulating layers of the plurality of insulating layers have different thicknesses. |
| 地址 |
Suwon-si KR |
