发明名称 LIGHT-EMITTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a light-emitting device that allows reproducibly improving electrical connectivity between a conductive circuit layer provided on a surface of a translucent insulator and an electrode of an LED chip and its reliability.SOLUTION: A light-emitting device 1 includes first and second translucent insulators 4 and 6, and light-emitting diodes 8 disposed between them. First and second electrodes 9 and 10 of the light-emitting diodes are electrically connected to conductive circuit layers 5 and 7 provided at least one surface of the first and second translucent insulators. Between the first translucent insulator and the second translucent insulator, a third translucent insulator 13 having at least one of a Vicat softening temperature of 80°C or more and 160°C or less and a tensile storage elastic modulus of 0.01 GPa or more and 10 GPa or less is embedded.
申请公布号 JP2015073103(A) 申请公布日期 2015.04.16
申请号 JP20140216366 申请日期 2014.10.23
申请人 TOSHIBA HOKUTO ELECTRONICS CORP 发明人 MAKI KEIICHI
分类号 H01L33/56;F21S2/00;F21S8/10;F21V19/00;G09F9/33;H01L21/60;H01L23/28;H01L25/04;H01L25/18;H01L33/62 主分类号 H01L33/56
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