发明名称 PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat-sealed package which eliminates the need of use of the same heat seal resin layer for the bottom material and the lid material and allows re-sealing simply by press-crimping with fingers.SOLUTION: As one of a lid material or a bottom material of a package, a multi-layer film formed by laminating, in order, a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C) and a heat seal resin layer (D) is used. The layer (B) is composed of a styrene thermoplastic elastomer of a peak temperature of the loss tangent of -35°C as the main ingredient, and the layer (D) is composed of a polyethylene adhesive resin having a Vicat softening point of 70-100°C, a weight average molecular weight peak value of 160,000-220,000 and a ratio of the weight average molecular weight to the number average molecular weight of 1.5-2.3 as the main ingredient.</p>
申请公布号 JP2015071290(A) 申请公布日期 2015.04.16
申请号 JP20140140149 申请日期 2014.07.08
申请人 MITSUBISHI PLASTICS INC 发明人 AMAO KIMIAKI
分类号 B32B27/30;B32B7/06;B65D77/20 主分类号 B32B27/30
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