APPARATUS AND METHOD FOR SELF-ALIGNING CHIP PLACEMENT AND LEVELING

摘要

An approach is provided for aligning and leveling a chip package portion. The approach involves filling, at least partially, a reservoir formed between a first sidewall portion having a first slanted surface and a second sidewall portion having a second slanted surface with a fluid. The approach also involves placing a chip package portion into the reservoir. The approach further involves draining the fluid from the reservoir to cause the chip package portion to align with respect to a center of the reservoir. The chip package portion aligns with respect to the center of the reservoir and levels based on a relationship between the chip package portion, an angle of the first slanted surface, an angle of the second slanted surface, and the fluid. The chip package portion is secured in the aligned and leveled state by a molding compound.

主权项

1. An apparatus comprising:
a base portion having an upper surface and a lower surface, the lower surface being opposite the upper surface; a first sidewall portion having a first upper portion distal the upper surface of the base portion; a second sidewall portion having a second upper portion distal the upper surface of the base portion; a first slanted surface facing in a direction toward the second sidewall portion and extending from the first upper portion of the first sidewall portion toward the upper surface of the base portion at a first angle; a second slanted surface facing in a direction toward the first side wall portion and extending from the second upper portion of the second sidewall portion toward the upper surface of the base portion at a second angle, the first slanted surface and the second slanted surface being configured to form a reservoir therebetween to accommodate a first chip package portion and cause the first chip package portion to align with respect to a center of the reservoir based on a relationship between the first chip package portion, the first angle, the second angle, and a fluid accommodated by the reservoir; and a first drain region between the first slanted surface and the second slanted surface configured to enable the fluid to egress from the reservoir.