ELECTRONIC COMPONENT-EMBEDDED MODULE AND COMMUNICATION TERMINAL DEVICE

摘要

To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

主权项

1. An electronic component-embedded module comprising:
an electronic component having a plurality of pads on its surface; and a multilayer substrate which is a multilayer body formed by stacking up a plurality of resin layers and in which a cavity is formed for containing the electronic component, wherein the plurality of resin layers of the multilayer substrate at least includes
a first resin layer at which a plurality of first pattern conductors and a space, which forms the cavity, are formed, anda second resin layer having at least one second pattern conductor and a plurality of third pattern conductors, the plurality of third pattern conductors being capable of having electrical conduction with either of the plurality of first pattern conductors or the plurality of pads, the second resin layer being placed over the first resin layer, the second pattern conductor is arranged around a first pad with a gap provided between the second pattern conductor and the first pad when viewed in plan in a layer stacking direction of the first resin layer and the second resin layer, the first pad being at least one of the plurality of pads, and a portion of the second resin layer is present between the second pattern conductor and the first pad.