ELECTRONIC SYSTEM COMPRISING STACKED ELECTRONIC DEVICES COMPRISING INTEGRATED-CIRCUIT CHIPS

摘要

An electronic system includes a first integrated-circuit chip and a second integrated-circuit chip. A first substrate wafer is positioned between the first and second integrated-circuit chips and configured with a first connection network to make electrical connection to the first integrated-circuit chip. A second substrate wafer, configured with a second connection network to make electrical connection to the second integrated-circuit chip, is positioned facing the first substrate wafer. The connection networks of the first and second substrate wafers are electrically connected through connection structures. A third substrate wafer, including a third connection network, is thermally in contact with the first integrated-circuit chip and electrically connected to the first connection network of the first substrate wafer through further connection structures. The further connection structure may be formed using another substrate wafer.

主权项

1. An electronic system, comprising:
a first integrated-circuit chip having an electrical connection front side and a back side; a second integrated-circuit chip; a first substrate wafer which extends between the first and second integrated-circuit chips, said electrical connection front side of the first integrated-circuit chip being mounted to a surface of said first substrate wafer; a second substrate wafer placed facing the back side of the first integrated-circuit chip; and a layer of thermally conductive adhesive interposed between the back side of first integrated-circuit chip and a surface of the second substrate wafer.