发明名称 LOW-MELTING BRAZING FILLER METAL
摘要 <p>The purpose of the present invention is to inhibit the formation of Cu3SnIMC in a lead-free, low-melting, Sn-Cu based brazing filler metal and thereby provide a low-melting brazing filler metal which can attain improved joint reliability. This brazing filler metal is an Sn-Cu alloy which further contains 0.1 to 2.0mass% of Ni. Specifically, the brazing filler metal has an Sn-Cu-Ni alloy composition that contains 0.1 to 2.0mass% of Ni and 7.6 to 41.4mass%, which corresponds to a hyper-eutectic range, of Cu with the balance being Sn and unavoidable impurities. Thus, the present invention makes it possible to inhibit the formation of Cu3SnIMC in a joint. Further, the melting point of the brazing filler metal is adjustable within a range of 415 to 640ºC, so that the brazing filler metal can be easily processed into various shapes.</p>
申请公布号 WO2015053114(A1) 申请公布日期 2015.04.16
申请号 WO2014JP75840 申请日期 2014.09.29
申请人 NIHON SUPERIOR CO., LTD.;THE UNIVERSITY OF QUEENSLAND 发明人 NISHIMURA, TETSURO;NOGITA, KAZUHIRO;MCDONALD, STUART DAVID;READ, JONATHAN JAMES;ZENG, GUANG
分类号 B23K35/26;C22C13/00 主分类号 B23K35/26
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