发明名称 |
LOW-MELTING BRAZING FILLER METAL |
摘要 |
<p>The purpose of the present invention is to inhibit the formation of Cu3SnIMC in a lead-free, low-melting, Sn-Cu based brazing filler metal and thereby provide a low-melting brazing filler metal which can attain improved joint reliability. This brazing filler metal is an Sn-Cu alloy which further contains 0.1 to 2.0mass% of Ni. Specifically, the brazing filler metal has an Sn-Cu-Ni alloy composition that contains 0.1 to 2.0mass% of Ni and 7.6 to 41.4mass%, which corresponds to a hyper-eutectic range, of Cu with the balance being Sn and unavoidable impurities. Thus, the present invention makes it possible to inhibit the formation of Cu3SnIMC in a joint. Further, the melting point of the brazing filler metal is adjustable within a range of 415 to 640ºC, so that the brazing filler metal can be easily processed into various shapes.</p> |
申请公布号 |
WO2015053114(A1) |
申请公布日期 |
2015.04.16 |
申请号 |
WO2014JP75840 |
申请日期 |
2014.09.29 |
申请人 |
NIHON SUPERIOR CO., LTD.;THE UNIVERSITY OF QUEENSLAND |
发明人 |
NISHIMURA, TETSURO;NOGITA, KAZUHIRO;MCDONALD, STUART DAVID;READ, JONATHAN JAMES;ZENG, GUANG |
分类号 |
B23K35/26;C22C13/00 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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