可硬化助熔剂组成物及焊接方法;A CURABLE FLUX COMPOSITION AND METHOD OF SOLDERING

摘要

提供一种可硬化助熔剂组成物，包括下列初始组分：每分子具有至少两个环氧乙烷基之树脂组分；式I所示之助熔剂：其中，R 1 、R 2 、R 3 和R 4 系独立选自氢、经取代之C1-80烷基、未经取代之C1-80烷基、经取代之C7-80芳基烷基和未经取代之C7-80芳基烷基；且其中，R 1 、R 2 、R 3 和R 4 中的0至3者为氢；以及，视需要的，硬化剂。此外，亦提供一种使用该可硬化助熔剂组成物焊接电气接点的方法。; a fluxing agent represented by formula I: wherein R 1 , R 2 , R 3 and R 4 are independently selected from a hydrogen, a substituted C1-80alkyl group, an unsubstituted C1-80alkyl group, a substituted C7-80arylalkyl group and an unsubstituted C7-80arylalkyl group; and wherein zero to three of R 1 , R 2 , R 3 and R 4 is(are) hydrogen; and, optionally, a curing agent. Also provided is a method of soldering an electrical contact using the curable flux composition.