| 摘要 |
<p>A light emitting element according to an embodiment of the invention includes an optical semiconductor layer (2) obtained by sequentially laminating a first semiconductor layer (2a), a light emitting layer (2b), and a second semiconductor layer (2c); a first electrode layer (3) that is electrically connected to the first semiconductor layer (2a); and a second electrode layer (7) that is electrically connected to the second semiconductor layer (2c). The second electrode layer (7) includes a conductive reflecting layer (4) positioned on the second semiconductor layer (2c), and a conductive layer (5) having a plurality of through holes (6) that are positioned on the conductive reflecting layer (4) and penetrate therethrough in a thickness direction thereof. A method for manufacturing a light emitting element according to the invention includes preparing a stacked body (30) obtained by sequentially laminating an optical semiconductor layer (2), a first metal layer (21), and a second metal layer (22) having a higher melting point than that of an oxide of the first metal layer (21); and forming a plurality of through holes (6) that penetrate the second metal layer (22) in a thickness direction thereof. The method for manufacturing a light emitting element according to the invention includes oxidizing, in</p> |
