| 摘要 |
There is disclosed an electronic device having a heat-dissipating structure. The electronic device comprises a circuit board; a heat conduction plate arranged to face the circuit board, and dissipate heat generated by the circuit board only in a direction parallel to the heat conduction plate. According to the present invention, the electronic device is particular suitable for the application wherein the electronic device will be stacked up on another electronic device and requires no any forced convection arrangement such as a fan. |
