| 摘要 |
Embodiments provide a light emitting device (100A) including a substrate (110), a light emitting structure (120) disposed under the substrate, the light emitting structure including a first conductive semiconductor layer (122), an active layer (124) and a second conductive semiconductor layer (126), a sub-mount (140), first and second metal pads (152, 154) disposed on the sub-mount and electrically spaced apart from one another, a one first bump (162) disposed between the first conductive semiconductor layer and the first metal pad (152) and a second bump (164) located between the second conductive semiconductor layer and the second metal pad (154) . A plurality of active areas containing the first semiconductor layer (122) and the active layer (124) are spaced apart from one another when viewed from above. |
