| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition formable of a cured product having excellent crack resistance even when heating time for curing is shortened. <P>SOLUTION: The curable epoxy resin composition contains an alicyclic epoxy compound (A) (excluding formula (2)), a monoallyldiglycidyl isocyanurate compound (B) expressed by formula (1) (in the formula, each of R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>is hydrogen or a 1C-8C alkyl group), an alycyclic epoxy compound (C) expressed by formula (2), a curing agent (D) and a curing catalyst (E). <P>COPYRIGHT: (C)2013,JPO&INPIT |
