| 摘要 |
<p>The present invention provides a substrate treating apparatus. The apparatus for processing a substrate includes: a housing, a returning unit which is located in the housing and is to return a substrate, a nozzle unit to spray the liquid on the substrate located in the returning unit, and a liquid supplying unit to supply the liquid to the nozzle unit, wherein, the liquid supplying unit can include a first provision line to provide the chemical to the nozzle unit, and a second provision line to provide washing liquid to the nozzle unit.</p> |
