发明名称 電子機器の放熱構造
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a simple and inexpensive heat radiating structure of an electronic apparatus with a minimum necessary structure by suitably disposing and opening components constituting an electric circuit, for efficiently cooling high heat generating components in the electronic apparatus. <P>SOLUTION: A platy heating component 11 disposed in a direction orthogonal to an electronic circuit main substrate 9 is disposed at a position near an intake portion 14 on the electronic circuit main substrate 9 to shield a cooling flow path from which air is taken in by the intake portion 14. Cooling means 18 is provided with a ventilation guide which has cooling air taken in from the intake portion 14 flow downstream while accelerating along the platy heating component 11 and guides the inside of an outer housing 2 to an exhaust portion 16 side, the ventilation guide being shared by the platy heating component 11. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5702962(B2) 申请公布日期 2015.04.15
申请号 JP20100163345 申请日期 2010.07.20
申请人 发明人
分类号 H05K7/20;H01L23/467 主分类号 H05K7/20
代理机构 代理人
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