发明名称 炭化珪素半導体装置およびその製造方法
摘要 <p>A substrate (1) is provided with a main surface (MS) having an off angle of 5° or smaller relative to a reference plane. The reference plane is a {000-1} plane in the case of hexagonal system and is a {111} plane in the case of cubic system. A silicon carbide layer is epitaxially formed on the main surface (MS) of the substrate. The silicon carbide layer is provided with a trench (6) having first and second side walls (20a, 20b) opposite to each other. Each of the first and second side walls (20a, 20b) includes a channel region. Further, each of the first and second side walls (20a, 20b) substantially includes one of a {0-33-8} plane and a {01-1-4} plane in the case of the hexagonal system and substantially includes a {100} plane in the case of the cubic system.</p>
申请公布号 JP5699878(B2) 申请公布日期 2015.04.15
申请号 JP20110200247 申请日期 2011.09.14
申请人 发明人
分类号 H01L29/12;H01L21/302;H01L21/336;H01L29/78 主分类号 H01L29/12
代理机构 代理人
主权项
地址