| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor inspecting probe card for reducing inspection cost, in an inspection apparatus using a contact system and a noncontact system, and to provide a manufacturing method for the card. <P>SOLUTION: The semiconductor inspecting probe card has a substrate, a probe card board disposed on a first main surface of the substrate, an inspection LSI equipped with a noncontact coupling circuit, and a power supply pin. The inspection LSI and the power supply pin are disposed on a second main surface located opposite to the first main surface of the substrate, the probe card board and the inspection LSI are electrically connected, and the probe card board and the power supply pin are electrically connected. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
