发明名称 |
LED ILLUMINATION MODULE AND LED ILLUMINATION APPARATUS |
摘要 |
[Problem] An LED illumination apparatus is provided which has high brightness and emits a great amount of light, and which is compact and lightweight. [Solution] An LED illumination module in which LED bare chips are mounted on a mounting substrate at a high density, the module comprising many LED bare chips having the same specifications, the mounting substrate at least a surface of which is metal, and a reflection region in which the LED bare chips are sealed off with resin, wherein a surface of the reflection region of the mounting substrate is covered with an inorganic white insulating layer that functions as a reflection member, a unit LED chip group including a plurality of LED bare chips connected in series is disposed plural, the plural unit LED chip groups being connected in parallel, overall light flux is 10,000 lumens or more, and a mounting area density of the LED bare chips in the reflection region is 15 mm 2 /cm 2 or more. An LED illumination apparatus including the LED illumination module is also provided. |
申请公布号 |
EP2860777(A1) |
申请公布日期 |
2015.04.15 |
申请号 |
EP20130800218 |
申请日期 |
2013.06.06 |
申请人 |
SHIKOKU INSTRUMENTATION CO., LTD. |
发明人 |
ISHIHARA, MASAMICHI;OYAMA, KENSHU;MURAKAMI, SHOJI;ONOSAKA, HITONOBU;SHIMA, MASATO |
分类号 |
H01L33/60;H01L23/12;H01L25/075;H01L33/62;H01L33/64;H05K1/05 |
主分类号 |
H01L33/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|