| 摘要 |
<p>The invention relates to a housing element (100) for an electronic device (10, 20), wherein said housing element (100) comprises thermally conductive material, wherein said housing element (100) comprises at least one opening (101), preferably a slit (101), between adjacent area regions (102, 104) of said housing element (100) to increase a thermal resistance between said area regions (102, 104), and wherein said at least one opening (101) is at least partly filled with sealing material (108).</p> |
