| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for taking out chips, having reduced unwanted operations of an imaging device and a nozzle. <P>SOLUTION: A method for taking out chips comprises: a map creation step of, when taking out chips 620 from first n (n is a natural number less than N) wafers 62 out of N (N is a natural number not less than 2) wafers 62 continuously processed, imaging the wafers 62 by an imaging device 33 so as to include outer edges of the wafers 62 in an imaging area, creating maps Mt each related to presence coordinates having the chips 620 and absence coordinates not having the chips 620, and taking out the chips 620 from the presence coordinates by a nozzle 8; and a target correction step of, when taking out the chips 620 from the n+1-th wafer 62 and afterward, excluding the absence coordinates from targets to be imaged by the imaging device 33 and targets to be taken out by the nozzle 8, and taking out the chips 620 from the presence coordinates. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
