| 摘要 |
Provided is a method for manufacturing an electrode plate in which short-circuiting can be minimized by removing excess adhered active material without damaging the electrode plate surface. A lattice substrate (1) made from lead or a lead alloy is packed with a paste-like active material and then pressed to produce a filled electrode plate, and the filled electrode plate is subjected to initial drying. A spiral airflow (8) is directed against the electrode plate surface of the initially dried filled electrode plate (10) and excess active material adhering to the electrode plate surface is removed. Furthermore, the active material on both end surfaces in the thickness direction of a frame skeleton (2) of the filled electrode plate (10) is removed using a brush. |
