发明名称 基板処理装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of achieving the enhancement of a treatment yield or the improvement of quality by achieving the uniformization of wet treatment over the whole main surface of a substrate. <P>SOLUTION: In the substrate treatment apparatus equipped with spray pipe parts 22 and a large number of spray nozzles 14 constituted of a large number of nozzle parts 24 formed adjacently in one row in the longitudinal direction of the spray pipe parts 22 to discharge a chemical solution to the surface 102 of the substrate W from the discharge orifices 26 thereof, a large number of nozzle parts 24 are formed to a large number of the spray pipe parts 22 so that the facing angles of the discharge orifices 26 of the large number of the nozzle parts 24 to the surface 102 of the substrate W become gradually small with respect to the normal line 300 of the surface 102 of the substrate W from the vicinity of the inclined upper end part of the surface 102 of the substrate W to the vicinity of the inclined lower end part thereof in the inclined lower end direction of the surface 102 of the substrate W fed in an inclined posture to make the flow velocity of the chemical solution after discharge relatively low in the vicinity of the inclined upper end part and relatively high in the vicinity of the inclined lower end part on the surface 102 of the substrate W. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5701551(B2) 申请公布日期 2015.04.15
申请号 JP20100211717 申请日期 2010.09.22
申请人 发明人
分类号 B08B3/02;B05B3/02;B05B13/02;G02F1/13;G02F1/1333;H01L21/304;H01L21/306 主分类号 B08B3/02
代理机构 代理人
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