发明名称 A BI-MODAL POWER DELIVERY SCHEME FOR INTEGRATED CIRCUITS THAT ENABLES FINE GRAIN POWER MANAGEMENT FOR MULTIPLE FUNCTIONAL BLOCKS ON A SINGLE DIE
摘要 <p>Systems and methods for bi-modal and fine grained power delivery to an integrated circuit comprising functional blocks. A first power source is coupled to a functional block of the integrated circuit for supporting a first operating mode of the functional block. A second power source is coupled to the functional block for supporting a second operating mode of the functional block. The first and second operating modes can be high and low frequency modes respectively. The second power source can be derived from the first power source using on-die regulators or provided independently. A desired average throughput of the functional block can be achieved by controlling duty cycles of the first and second power sources.</p>
申请公布号 EP2859426(A1) 申请公布日期 2015.04.15
申请号 EP20130730426 申请日期 2013.06.06
申请人 QUALCOMM INCORPORATED 发明人 KOLLA, YESHWANT NAGARAJ;FISCHER, JEFFREY HERBERT;FLEDERBACH, WILLIAM R.
分类号 G06F1/26;G06F1/32;H02M3/155 主分类号 G06F1/26
代理机构 代理人
主权项
地址