| 发明名称 | Electronic apparatus and hard disk drive | ||
| 摘要 | According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other. | ||
| 申请公布号 | US9007779(B2) | 申请公布日期 | 2015.04.14 |
| 申请号 | US201213358432 | 申请日期 | 2012.01.25 |
| 申请人 | Kabushiki Kaisha Toshiba | 发明人 | Yamamoto Nobuhiro;Funayama Takahisa |
| 分类号 | H05K5/00;H05K7/00;H05K1/16;H05K1/02;G11B25/04;H05K3/40 | 主分类号 | H05K5/00 |
| 代理机构 | Blakely, Sokoloff, Taylor & Zafman LLP | 代理人 | Blakely, Sokoloff, Taylor & Zafman LLP |
| 主权项 | 1. An electronic apparatus comprising: a case; a printed circuit board contained in the case and comprising a through-hole; a fixing member comprising a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion, and configure to fix the printed circuit board and the case to each other, and to be electrically connected with the case; a copper foil provided on the printed circuit board; a cover film covering at least a portion of the copper foil and comprising an opening portion configured to expose a part of the copper foil, the opening portion being covered with the head portion; and a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other, wherein the conductive material is enclosed in the opening portion of the cover film by the head portion and an inner surface of the opening portion, wherein the copper foil and the conductive material are sealed with the head portion and the opening portion of the cover film, and the conductive material is flushed with a top surface of the cover film which is covered by the head portion. | ||
| 地址 | Tokyo JP | ||