| 发明名称 | Wiring board and light emitting device | ||
| 摘要 | There is provided a wiring board for mounting a light emitting element thereon. The wiring board includes: an insulating layer; a wiring pattern on the insulating layer; a reflecting layer on the insulating layer to cover the wiring pattern, wherein the light emitting element is to be mounted on a surface of the reflecting layer; and a silica film on the surface of the reflecting layer. | ||
| 申请公布号 | US9006894(B2) | 申请公布日期 | 2015.04.14 |
| 申请号 | US201414206131 | 申请日期 | 2014.03.12 |
| 申请人 | Shinko Electric Industries Co., Ltd. | 发明人 | Kobayashi Kazutaka;Horikawa Yasuyoshi;Aizawa Mitsuhiro;Hara Koji |
| 分类号 | H01L23/48;H01L33/60;H01L33/62;H05K1/02;H01L25/075 | 主分类号 | H01L23/48 |
| 代理机构 | Rankin, Hill & Clark LLP | 代理人 | Rankin, Hill & Clark LLP |
| 主权项 | 1. A wiring board for mounting a light emitting element thereon, the wiring board comprising: an insulating layer; a wiring pattern on the insulating layer; a reflecting layer on the insulating layer to cover the wiring pattern, wherein the light emitting element is to be mounted on a surface of the reflecting layer; and a silica film on the surface of the reflecting layer. | ||
| 地址 | Nagano-Shi JP | ||