| 发明名称 | Ceramic substrate and process for producing same | ||
| 摘要 | A ceramic substrate includes a substrate body formed of ceramic and having a pair of surfaces each assuming a rectangular shape as viewed in plane, and a metallization layer formed on the surface of the substrate body and adapted to braze a metal frame thereon. A composite material layer is disposed between the surface of the substrate body and the metallization layer and is formed such that a ceramic portion, a metal portion 10m formed of a metal similar to a metal component of the metallization layer or a metal which, together with a metal component of the metallization layer, forms an all proportional solid solution, and a glass portion exist together. The thickness of the composite material layer is thinner than that of the metallization layer. A plating layer is deposited on the surface of the metallization layer. | ||
| 申请公布号 | US9006582(B2) | 申请公布日期 | 2015.04.14 |
| 申请号 | US201314235529 | 申请日期 | 2013.03.12 |
| 申请人 | NGK Spark Plug Co., Ltd. | 发明人 | Tojo Takatoshi;Suzumura Shinji;Yoshida Yoshitaka;Ogawa Masahiro |
| 分类号 | H05K1/03;H01L23/10;H05K3/10;H01L23/08 | 主分类号 | H05K1/03 |
| 代理机构 | Stites & Harbison PLLC | 代理人 | Stites & Harbison PLLC ;Haeberlin Jeffrey A. |
| 主权项 | 1. A ceramic substrate comprising a substrate body formed of ceramic and having a pair of surfaces each assuming a rectangular shape as viewed in plane, and a metallization layer formed on at least one of the surfaces of the substrate body and adapted to mount a metal member thereon, and characterized in that a composite material layer is formed between the surface of the substrate body and the metallization layer and is formed such that a ceramic portion, a metal portion formed of a metal similar to a metal component of the metallization layer or a metal which, together with a metal component of the metallization layer, forms an all proportional solid solution, and a glass portion exist together, a thickness of the composite material layer is thinner than a thickness of the metallization layer, and a plating layer is deposited on a surface of the metallization layer. | ||
| 地址 | Nagoya JP | ||