Electronic device with heat dissipation module

摘要

An electronic device includes an enclosure, a circuit board arranged in the enclosure, a heat dissipation module set on the circuit board, and a fan arranged in the enclosure and aligned with the heat dissipation module. The heat dissipation module includes a base and a number of fins. A number of parallel receiving portions are formed on the base.;A slot is defined in each retaining portion. Each fin includes a main plate and a pivoting portion formed at a bottom the main plate. The pivoting portions are respectively and pivotably received in the slots of the base.

主权项

1. A heat dissipation module, comprising:
a base comprising a plurality of parallel elongated receiving portions, each of the receiving portions defines an elongated slot with a semicircular cross-section; and a plurality of fins each comprising a main plate and a pivoting portion with semicircular cross-section formed from a bottom side of the main plate, wherein the pivoting portions are respectively and pivotably received in the slots.