| 发明名称 | Solder mask shape for BOT laminate packages | ||
| 摘要 | A device is provided. The device may comprise an integrated circuit package. The integrated circuit package may comprise a first layer and a solder mask. The first layer may comprise a top surface wherein the solder mask is disposed on the top surface of the first layer. The solder mask may comprise a vertical edge. The vertical edge may form an angle between the top surface of the first layer and the vertical edge of not less than 90 degrees. The angle may be not less than 120 degrees or not less than 150 degrees. | ||
| 申请公布号 | US9006909(B2) | 申请公布日期 | 2015.04.14 |
| 申请号 | US201313733537 | 申请日期 | 2013.01.03 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Chang Chih-Horng;Wu Sheng-Yu;Tsai Pei-Chun;Kuo Tin-Hao;Chen Chen-Shien |
| 分类号 | G03F1/00 | 主分类号 | G03F1/00 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A device comprising: an integrated circuit package comprising; a first layer having a top surface; anda solder mask disposed on the top surface of the first layer, the solder mask comprising a vertical edge, wherein the vertical edge forms an angle between the top surface of the first layer and the vertical edge of not less than 120 degrees. | ||
| 地址 | Hsin-Chu TW | ||