| 发明名称 |
Selective leadframe planishing |
| 摘要 |
A method for fabricating a leadframe strip is disclosed. A leadframe pattern is formed from flat sheet of base metal. Additional metal layers are plated on patterned tape of base metal and the leadframe surface is roughed. A first set of leadframe areas is planished. A second set of leadframe areas are offsetted and the tape is cut into strips. |
| 申请公布号 |
US9006038(B2) |
申请公布日期 |
2015.04.14 |
| 申请号 |
US201313937590 |
申请日期 |
2013.07.09 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Abbott Donald C. |
| 分类号 |
H01L21/48;H01L21/64;H01L23/495 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
Shaw Steven A.;Cimino Frank D. |
| 主权项 |
1. A method for fabricating a leadframe strip, said method comprising:
forming a leadframe pattern from a flat tape of base metal; plating a plurality of additional metal layers on the patterned tape of base metal and flood roughening the surface of the metal layers; and selectively planishing a selected first set of leadframe areas, offsetting a second set of leadframe areas, and cutting tape into strips. |
| 地址 |
Dallas TX US |
