Cu—Ni—Si alloy for electronic material

摘要

The distribution of Ni—Si compound grains is controlled to thereby improve the properties of Corson alloys. The copper alloy for electronic materials comprises 0.4 to 6.0% mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities.;The copper alloy comprising:
small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 μm and smaller than 0.3 μm; andlarge particles of Ni—Si compound having a particle size of equal to of greater than 0.3 μm and smaller than 1.5 μm.;The number density of the small particles is 1 to 2000 pieces/μm2 and the number density of the large particles is 0.05 to 2 pieces/μm2.

主权项

1. A copper alloy for electronic materials comprising 0.4 to 6.0% by mass of Ni and 0.1 to 1.4% by mass of Si, with the balance being Cu and unavoidable impurities, the copper alloy comprising:
small particles of Ni—Si compound having a particle size of equal to or greater than 0.01 μm and smaller than 0.3 μm; and large particles of Ni—Si compound having a particle size of equal to or greater than 0.3 μm and smaller than 1.5 μm; wherein the number density of the small particles is 1 to 2000 pieces/μm2 and the number density of the large particles is 0.05 to 2 pieces/μm2.