发明名称 Memory device and receptacle for electronic devices
摘要 A random access memory (RAM) memory module has a compact form factor and is removable from a corresponding socket assembly to allow easy replacement of the memory module or reconfiguration of the memory module during development of an electronic device that includes the memory module.
申请公布号 US9007783(B2) 申请公布日期 2015.04.14
申请号 US201113176889 申请日期 2011.07.06
申请人 Sony Corporation;Sony Mobile Communications AB 发明人 Bolanowski Wladyslaw;Aberg Peter
分类号 H05K1/14;H05K1/11;H05K7/10 主分类号 H05K1/14
代理机构 Renner, Otto, Boisselle & Sklar, LLP 代理人 Renner, Otto, Boisselle & Sklar, LLP
主权项 1. An electrical assembly, comprising: a printed circuit board retaining electrical circuitry; a memory module, including: a rectangular module body having a length in a length direction, a width in a width direction, and a thickness in a thickness direction, and the module body configured with two opposing sides in the length direction and two opposing sides in the width direction, the sides in the length direction separated by the sides in the width direction and the sides in the width direction separated by the sides in the length direction, each side comprising a first wall and a second wall, the walls parallel to the thickness direction, and wherein the length direction, the width direction and the thickness direction are mutually orthogonal;a random access memory (RAM) memory core retained by the module body; andfor each side of the module body: a first plurality of contacts disposed at the first wall; anda second plurality of contacts disposed at the second wall, electrical connection between the memory core and the electrical circuitry made through the first and second plurality of contacts, the electrical circuitry external to the memory module; and a socket assembly corresponding to the memory module and mounted to the printed circuit board, the socket assembly interposed between the memory module and the printed circuit board, the socket assembly including: a connector portion shaped in coordination with the memory module into which the module body is received and retained; andfor each side of the module body: a first plurality of connector pins disposed adjacent the connector portion, each of the first plurality of connector pins in alignment and electrical contact with a respective one of the first plurality of contacts of the memory module; anda second plurality of connector pins disposed adjacent the connector portion, each of the second plurality of connector pins in alignment and electrical contact with a respective one of the second plurality of contacts of the memory module, electrical connection between the memory core and the electrical circuitry made through the first and second plurality of connector pins.
地址 Tokyo JP